HW Engineer Lead

Position :: HW Engineer Lead

Location;: Pleasanton, CA

Contract role

Skills ::

2. HW design and development by using 16bit/32 bit /64bits microcontroller/microprocessor for embedded system

3. Owning & maintaining detailed schematics, components library, BOM Requirement and design documents for designed module.

4. Provide PCB layout design guidelines to PCB designers and maintain Gerbers files

5. Perform component selection keeping in consideration of optimized cost / EOL and applicable compliance for NPDs

6. Provide detailed component analysis, tolerance analysis, simulations

7. Preparation of Functional test plans and Pre-Compliance test plan for designed module

8. Troubleshooting hardware, debug firmware and optimize performance.

9. Work closely with test labs for agency certifications like FCC/CE/UL/FM, etc.

10. Follow internal hardware and firmware development processes

11. Ability to communicate concepts, unit and system level hardware design, design validation test results and progress of projects to core team

Job role ::

The experience and skills required include but are not limited to the following:

1. Strong knowledge mixed signal embedded system design by using 16 bit/16/32-bit micro controllers or processors e.g ATSAM54XXseries, TI's -AM43xx/335/62X, SOMs like QualComm XR2 or similar

2. Hands on experience in interfacing of highspeed devices -like DDR4/DDR3 /USB/Ethernet etc

3. Thorough experience in evaluating and interacting various types of displays Interfaces (LCD touch screen)

4. Hands on experience in evaluating and design/dev of different Wireless (Wi-Fi/BLE/Cellular) technologies

5. Hands on experience of design & debugging different communication interfaces like I2C, SPI, RS232, RS485, CAN, BLE, external memories, LCD & touch screen interfaces etc.

6. Proficiency in Schematic capture tools like Orcad/PADs.

15. Proficiency in circuit analysis, circuit simulation using PSpice/spice / and circuit tolerance analysis is must.

Hands on experience - design adhere to applicable EMC-EMI guidelines (IEC61XXXX, )

16. Hands on experience in evaluating and interacting with various types of cameras

6. Thorough experience in dealing/guiding PCB designer for multilayer highspeed boards

7. Knowledge of Signal Integrity concept specific to DDR3/DDR4

BE/BTech/ME/MTech in Electrical and Electronics Engineering (EEE) or Electronics and Communication Engineering (ECE) or Electronics & Instrumentation Engineering from an accredited university/college.